|
CODE
|
MOUNT
|
MATERIAL
|
PACKAGE TYPE |
DEVICE
|
PINS
|
PINS
|
PINS
|
|
00
|
Insertion
|
Ceramic
|
DIP
Cerdip Glass-Seal |
|
8 Pin
|
14 Pin
|
16 Pin
|
|
01
|
Insertion
|
Plastic
|
DIP |
|
8
Pin
|
14
Pin
|
16
Pin
|
| |
|
|
|
|
20
Pin
|
|
|
|
02
|
Surface
|
Plastic
|
SOIC
Small Outline IC PSOP 154Mil |
|
SO-8
8
Pin
|
SO-14
14
Pin
|
SO-16
16
Pin
|
|
03
|
Surface
|
Plastic
|
SSOP
Shrink Small Outline 177mil |
|
PW008
8
Pin
|
PW014
14
Pin
|
PW016
16
Pin
|
| |
|
|
|
|
PW020
20
Pin
|
|
|
|
04
|
Chip
Carrier
|
Plastic
|
PLCC
Plastic Leaded Chip Carrier |
|
EP
20
Pin
|
EA,EB
EP
28
Pin
|
32
Pin
|
| |
|
|
|
|
EB,EP
44
Pin
|
|
|
|
05
|
Surface
|
Plastic
|
DPAK |
|
3
Pin
|
|
|
|
06
|
Flange
|
Plastic
|
TO-220 |
|
3
Pin
|
5
Pin
|
|
|
07
|
Insertion
|
Metal Can
|
TO-18 |
|
3
Pin
|
|
|
|
08
|
Flange
|
Metal Can
|
TO-3 |
|
2
Pin
|
|
|
|
09
|
Insertion
|
Metal Can
|
TO-8 |
|
7
Pin
|
12
Pin
|
|
|
10
|
Insertion
|
Metal Can
|
TO-5 |
|
3
Pin
|
|
|
|
11
|
Insertion
|
Metal Can
|
TO-99 |
|
9
Pin
|
|
|
|
12
|
Flange
|
|
714G-01 Motorola |
|
9
Pin
|
|
|
|
13
|
Surface
|
Microstrip
|
AF320 Minicircuits |
|
AF320
|
|
|
|
14
|
Surface
|
Microstrip
|
MACRO-X (317-01)
Motorola |
|
4
Pin
|
|
|
|
15
|
Insertion
|
Metal Can
|
TO-39 (31A-01) Motorola |
|
3
Pin
|
|
|
|
16
|
Surface
|
Microstrip
|
35 MICRO-X HP |
|
4
Pin
|
|
|
|
17
|
Surface
|
Microstrip
|
70 MIL |
|
4
Pin
|
|
|
|
18
|
Surface
|
Epoxy
Strip Line
|
E26 |
|
2
Pin
|
|
|
|
19
|
Surface
|
Epoxy
Strip Line
|
E28 Metelics Corp. |
|
2
Pin
|
|
|
|
20
|
Surface
|
Epoxy
Strip Line
|
E50 |
|
5
Pin
|
|
|
|
21
|
Surface
|
|
301 Pulsar Microwave |
|
8
Pin
|
|
|
|
22
|
|
|
Not Used |
|
|
|
|
|
23
|
Surface
|
Plastic
|
SOT-23 (318-07)
(TO-236AB) Motorola |
|
3
Pin
|
5
pin |
|
|
24
|
Surface
|
Plastic
|
SOT-89 (TO-243AA) |
|
4
Pin
|
|
|
|
25
|
Surface
|
Plastic
|
SOT-103 |
|
4
Pin
|
|
|
|
26
|
Surface
|
Plastic
|
SOT-143 |
|
4
Pin
|
|
|
|
27
|
Surface
|
Plastic
|
SOT-223 |
|
4
Pin
|
|
|
|
28
|
|
|
Not used |
|
|
|
|
|
29
|
Insertion
|
Plastic
|
Wide Plastic DIP 600mil |
|
24
Pin
|
28
Pin
|
40
Pin
|
|
30
|
Surface
|
Plastic
|
D2PAK |
|
3
Pin
|
5
Pin
|
|
|
31
|
Surface
|
Plastic
|
SOIC
Small Outline IC PSOP 300mil |
|
16
Pin
|
20
Pin
|
24
Pin
|
|
32
|
Surface
|
Plastic
|
SOIC
Small Outline IC PSOP 330mil |
|
16Pin
|
24
Pin
|
28
Pin
|
|
33
|
Surface
|
Plastic
|
SOIC
Small Outline IC PSOP 350mil |
|
28
Pin
|
|
|
|
34
|
Chip
Carrier
|
Plastic
|
SOJ
Small Outline Package J-Lead |
|
28
Pin
|
|
|
|
35
|
Surface
|
Plastic
|
SSOP
Shrink Small Outline 209mil |
|
DB008
8
Pin
|
DB014
14
Pin
|
DB016
16
Pin
|
| |
|
|
|
|
DB020
20
Pin
|
|
|
|
36
|
Surface
|
Plastic
|
SC59 (318D-03) |
|
3
Pin
|
|
|
|
37
|
Socket
|
|
PGA Pin Grid Array |
|
209 Pin
|
|
|
|
38
|
Chip
Carrier
|
Ceramic
|
LCCC
Leadless Ceramic Chip Carrier |
|
|
|
|
|
39
|
Surface
|
Plastic
|
PLCC Socket
Plastic Leaded Chip Carrier Socket |
|
20
Pin
|
28
Pin
|
32
Pin
|
| |
|
|
|
|
>44
Pin
|
|
|
|
40
|
Insertion
|
Plastic
|
PLCC Socket
Plastic Leaded Chip Carrier Socket |
|
20
Pin
|
28
Pin
|
32
Pin
|
| |
|
|
|
|
44
Pin
|
|
|
|
41
|
Surface
|
Plastic
|
QFP Quad Flatpack |
|
|
|
|
|
42
|
Surface
|
Ceramic
|
CQFP
CeramicQuad Flatpack Solder-Seal |
|
|
|
|
|
43
|
Surface
|
Plastic
|
Quad Flatpack |
|
|
|
|
|
44
|
Surface
|
Ceramic
|
CERQUAD
Glass sealed J-leads |
|
52
Pin
|
|
|
|
45
|
Surface
|
Ceramic
|
Ceramic Flatpack
Dual Row Solder-Seal |
|
|
|
|
|
46
|
Surface
|
Ceramic
|
CERPACK
Dual Row Glass-Seal |
|
|
|
|
|
47
|
Surface
|
Plastic
|
TSOP
Thin Small Outline Package |
|
|
|
|
|
48
|
Insertion
|
Plastic
|
T0-92 |
|
3 Pin
|
|
|
|
49
|
Insertion
|
Metal
|
DIP
300 mils |
|
14
Pin
|
|
|
|
50
|
Insertion
|
Ceramic
|
DIP WIDE
800 mils |
|
24 Pin
|
|
|
|
51
|
Insertion
|
Ceramic
|
TO-12 |
|
4 Pin
|
|
|
|
52
|
Insertion
|
Plastic
|
OMNIPAK |
|
32 Pin
|
|
|
|
53
|
Flange
|
Plastic
|
TO-221A |
|
3
Pin
|
|
|
|
54
|
Surface |
Plastic |
DIP Gull Wing
250 mils |
|
8
Pin
|
|
|
Integrated Circuit (IC) Headquarters